Measurement Technique:
Stylus profilometry
(contact measurement)

Measurement Capability:
Two-dimensional surface profile measurements
with optional three-dimensional measurement/analyses

Sample Viewing:
Selectable magnification, 1 to 4mm FOV

Stylus Sensor:
Low Inertia Sensor (LIS 3)

Stylus Force:
1 to 15mg with LIS 3 sensor; Low Force Option
   N-Lite+ Low Force with 0.03 to 15mg

Stylus Options: 
Radius options from 50nm to 25-m
High Aspect Ratio (HAR) tips 10-m x 2-m and
   200-m x 20-m
Custom tips available upon request

Sample X/Y Stage:
Manual 100mm (4 in.) X/Y, manual leveling
Motorized 150mm (6 in.) X/Y, manual leveling
R-Theta Stage Manual, continuous 360 degrees
Motorized, continuous 360 degrees

Computer System:
64-bit multi-core parallel processor, WIN 7

Display:
Optional 23in. flat panel display

Software:
Vision64 Operation and Analysis Software
- Stress Measurement
- Cantilever Deflection
- Stitching
- 3D Stress and 3D Mapping

Vibration Isolation:
Vibration isolation solutions available

Scan Length Range:
55mm (2in.)

Data Points Per Scan:
120,000 maximum

Max. Sample Thickness:
50mm (2in.)

Max. Wafer Size:
200mm (8in.)

Step Height Repeatability:
<5Å, 1sigma on 1-m step

Vertical Range:
1mm (0.039in.)

Vertical Resolution:
1Å max. (@ 6.55-m range) 

Input Power:
100 – 240 VAC, 50 – 60Hz

Temperature Operating Range:
20 to 25°C (68 to 77°F)

Humidity Range:
80%, non-condensing

System Dimensions and Weight:
455mm W x 550mm D x 370mm H
(17.9in. W x 22.6in. D x 14.5in. H)
34kg (75lbs.)

Enclosure: 550mm L x 585mm W x 445mm H (21.6in. L x 23in. W x 17.5in. H)
21.7kg (48lbs.)