Electron Beam Sources and Power Supplies

Here at IES, Electron Beam Sources and Power Supplies are readily available to our customers who are working in the thin film and plasma processing fields.

Plasma Ashing and Desmear Equipment

Removing photoresist masks after RIE or ion implant is a very important and frequently per- formed step in front-end semi- conductor manufacturing. Plasma photoresist ashing as a dry and eco-friendly process is replacing wet stripping / wet etching technologies.

Let IES Technical Sales help you decide your Plasma Ashing equipment using either Microwave or RF excitation, offering both Single Wafer and Batch Ashers. Microwave plasma is ideal for resist removal, generating a very high concentration of chemically active species along with low ion bombardment energy, guaranteeing fast ash rate and damage-free plasma processing. Microwave plasma systems are suitable for various substrates like Si, III/V-compounds, quartz, ceramic, lithium niobate, copper interconnect devices etc.

Magnetron Plasma Sputtering

A critical component of the thin film deposition process, magnetron sputtering has become invaluable. Creating quality thin film coatings uses magnets to control the activity of high energy plasma. By this process, nanometer thin layers can be efficiently applied to substrates in a wide variety of applications.

Plasma Sources - Remote Plasma

Remote and inductive plasma source and power-delivery systems are available in a high-conductance, low-surface-area geometry. They are well suited to deliver reactive gas species to processes such as wafer pre-clean, photoresist strip, and atomic layer deposition (ALD). In addition, the high power density and high conductance makes it the ideal platform for post-process exhaust gas abatement.

DC, AC, and RF Plasma

IES is a provider of critical subsystems for thin film processing including DC, AC, and RF power management.

Reactive Sputtering Process Control System

A Reactive Sputtering Control System for high speed adjustment of a reactive gas for magnetron sputter processes. An advanced direct digital control system which is adaptive to flow requirements and has many advantages over analog PID based solutions. It has a PC networked set-up and monitoring program, but the control algorithm is 'nested' in a stand-alone control box located near to the process chamber.