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Proforma Series Literature

Basic Product Applications

  • Slicing
    • Saw set-up
      • Thickness
      • TTV
    • Degradation monitoring
      • Wire guide re-grooving
      • Blade replacement
  • Lap/etch and polishing
    • Process monitoring
    • Thickness
    • TTV
    • Material removal
    • Bow
    • Warp
    • Flatness
  • Backgrind
    • Removal rate
  • Final Inspection
    • Lot sampling
    • Final thickness

MTI Instruments Semiconductor Metrology Systems

MTI Instruments' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any wafer material including Silicon (Si), Gallium Arsenide (GaAs), Germanium (Ge) and Indium Phosphide (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness and TTV, bow, warp, resistivity, site and global flatness measurement.

product proforma300sa

Proforma 300SA 

The Proforma 300SA is a semi-automated wafer metrology tool used in thickness measurement for both semiconducting and semi-insulating wafer materials. Capable of handling wafer diameters of 150mm, 200mm and 300mm, the Proforma 300SA provides highly accurate, repeatable measurements of thickness, TTV, wafer bow, warp, site and wafer global flatness.

 product proforma200sa

Proforma 200SA

The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 75 to 200 mm. wafers, the 200SA provides highly accurate, repeatable measurements of surface thickness, TTV, bow, warp, site and global flatness.

 product proforma300

Proforma 300

Fast, accurate, and reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV).  Thickness and TTV values are obtained by placing the wafer between non-contact capacitance probes. The Teflon coated wafer stage allows for easy, non-abrasive positioning of the wafer, while removable locating pins can be utilized for precise center thickness measurements.

 product pv1000

PV-1000

Using MTII’s exclusive push/pull capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness variation (TTV) and wafer bow.


The proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII's solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, Total Thickness Variation, and wafer bow at the speed of 5 wafers/second.

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Request More Information about

The Proforma Series or PV-1000

 

IES is your MTI Instruments and Proforma Series representative for New England and New York. Please call or email us for all your thin film and surface measurement needs. We will provide fast response on any requirement including quotations, product specifications, and product recommendations.

 

We can meet your needs with anything regarding a price quote, service questions, or comparrisons.  IES Technical Sales is here to help our customers in making the right choice with their semiconductor process needs.