Measurement and Analysis Systems

IES Technical Sales offers:   

• Stylus Profilometers
• Optical Profilometers
• Wafer Thickness and Bow Measurement Systems 
• Residual Gas Analyzers
• Surface Acousitc Wave Measurement Systems
• Water Stress Measurement Systems
• Ion Implant Dose Measurement Systems

   Bruker Nano Metrology Surface Profilometers 

If you need to measure step heights, roughness, stress, or waviness, whether on a flat surface or a non-flat surface, Bruker Nano Metrology is your best choice. Whether it be the 40+ year market leading Dektak Series (contact stylus type, shown on left), or the new and upcoming Contour Series (non-contact optical type), contact IES for your surface measurement requirements. 

   PVA TePla Thin Film Stress, Ion Implant Dose, and
   Structural Defect Measurement Instruments

    Stress Measurement: SIRD System (shown on left), available in lab and production models.
    Ion Implant Dose Measurement: TWIN System, available in lab and production models.
    Structural Defect Measurement: SAM Surface Acoustic Wave system, available in lab and 
         production models.
 

MTI Instruments 300mm Semi-Auto Wafer Measurement 

The Proforma 300SA is a semi-automated wafer metrology tool used in thickness measurement for both semiconducting and semi-insulating wafer materials. Capable of handling wafer diameters of 150mm, 200mm and 300mm, the Proforma 300SA provides highly accurate, repeatable measurements of thickness, TTV, wafer bow, warp, site and wafer global flatness.

MTI Instruments 200mm Semi-Auto Wafer Measurement

The Proforma 200SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 75 to 200 mm. wafers, the 200SA provides highly accurate, repeatable measurements of surface thickness, TTV, bow, warp, site and global flatness.

MTI Instruments Manual Wafer Measurement 

Fast, Accurate, and Reliable, the Proforma 300 measures wafers up to 300 mm in diameter for both thickness and total thickness variation (TTV).  Thickness and TTV values are obtained by placing the wafer between MTI Instruments' non-contact capacitance probes. The Teflon coated wafer stage allows for easy, non-abrasive positioning of the wafer, while removable locating pins can be utilized for precise center thickness measurements.

MTI Instruments Push/Pull Capacitive Probe

Using MTII’s exclusive Push/Pull capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness variation (TTV) and wafer bow.